PROFESSIONAL LED LAMP BULB DOB SUPPLIER

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LAMP PARTS GALLERY

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PRODUCTION TECHNICAL

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- SMT Process - 

- DIP Process - 

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SMT

Surface Mount Technology (SMT) is an advanced electronic assembly process where electronic components are mounted directly onto the surface of printed circuit boards (PCBs), rather than being inserted through holes. This innovative technique has revolutionized modern electronics manufacturing by enabling higher component density, reduced board size, and improved production efficiency

 

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DIP

DIP (Dual In-line Package) insertion is a through-hole mounting technology widely used in printed circuit board (PCB) assembly. This technique involves inserting electronic components with two parallel rows of pins—such as integrated circuits (ICs), resistors, capacitors, and connectors—into pre-drilled holes on the PCB.

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